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Editor Overview

The PCB editor includes:
  • Layer stack — Manage copper, silkscreen, mask, and mechanical layers
  • Ratsnest — Visual guides showing unrouted connections
  • 3D Viewer — Preview your board in 3D (Alt+3)
  • Design rules — Configurable constraints for trace width, clearance, etc.

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AI Layer Control

Ask the AI to switch between PCB layers, apply layer presets, or toggle layer visibility directly from the chat. For example, “switch to the back copper layer” or “hide all silkscreen layers.”

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Component Placement

After importing from the schematic (F8), arrange components on the board:
  • Move components with M
  • Rotate with R
  • Flip to the back side with F
  • Group related components together
  • Keep high-frequency components close to their connections
  • Align connectors with board edges

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AI Auto-Placement

Trace includes an AI-powered auto-placer that uses a graph neural network (GNN) combined with simulated annealing for placement optimization. The AI analyzes your schematic to understand component connectivity, signal flow, and relationships, then optimizes component positions.
  • Import optimization — Import existing KiCad boards and let the AI optimize component placement, especially effective for boards where placement was done manually and could benefit from optimization
  • Signal flow analysis — The GNN learns component connectivity patterns to place related components close together
  • Constraint-aware — Respects board outline, keep-out zones, and mechanical constraints during optimization
  • EMI-aware placement — The placer considers electromagnetic interference when positioning sensitive analog and high-speed digital components, keeping noisy components away from sensitive inputs (expanding)
You can ask the AI to place all components or just a specific group.
The auto-placer is under active development. The current version handles placement optimization with GNN + simulated annealing. Deeper constraint awareness — thermal management, enclosure fit, and pick-and-place constraints — is in progress.

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Routing

Route traces manually or use the autorouter:
  • Press X to start routing a trace
  • Press V to place a via and switch layers
  • The autorouter handles all connections automatically
  • Manual routing gives you full control over trace paths

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Layer Stackup & Impedance Control

These features are experimental and under active development.
For controlled-impedance designs, Trace follows a stackup-first workflow:
  1. Define the stackup — Set layer count, copper weight, and dielectric thickness for your board
  2. Derive trace widths — Trace calculates trace widths for controlled impedance based on your stackup parameters
  3. Lock before routing — Impedance-controlled widths are locked into net classes before routing begins, so traces maintain correct geometry throughout the layout

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Differential Pairs

Differential pairs (USB, LVDS, DDR, PCIe) are handled with dedicated constraints:
  • Coupled routing — Diff pairs are routed together with controlled spacing enforced during routing
  • Length matching — Intra-pair and inter-pair length matching to maintain signal timing
  • Reference plane tracking — Return paths are tracked to keep them continuous across the reference plane, avoiding splits that degrade signal integrity

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Signal Integrity Considerations

  • High-speed nets are identified from the schematic and flagged for priority routing
  • Via stitching near signal transitions between layers
  • Copper pour optimization for thermal and EMI performance

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Design Rule Check

Run DRC to verify your layout meets manufacturing constraints:
  • Minimum trace width and spacing
  • Via drill sizes and annular rings
  • Courtyard clearances between components
  • Board edge clearances
  • Impedance rule violations
  • Unrouted nets
Access via Inspect → Design Rules Checker or Ctrl+Shift+D.

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Copper Pours

Add copper fill zones for ground planes and power distribution:
  1. Press Ctrl+Shift+Z to add a filled zone
  2. Select the net (usually GND)
  3. Draw the zone boundary
  4. Press B to fill all zones

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Case Design Import

Import your enclosure design to use as a reference layer while designing your PCB. This lets you align mounting holes, connectors, and components with your physical case before manufacturing.

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Supported Formats

  • DXF — 2D outline from CAD software (Fusion 360, SolidWorks, FreeCAD)
  • STEP/STP — 3D models for full enclosure visualization

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Use Cases

  • Align USB ports, buttons, and LEDs with case cutouts
  • Position mounting holes to match enclosure standoffs
  • Verify antenna keep-out zones for Bluetooth/WiFi
  • Check battery compartment clearances
  • Ensure component height fits within enclosure